Applications:
1.Flat panel TV, mobile equipment, high-speed hard disk drive
2.Between semiconductor and heat sink
3.Computer, PC server, workstation
4.LED lighting, lighting equipment
5.The chip and chip component
Performance and characteristics:
1.High thermal conductivity, heat transfer coefficient 5.2W/m-k
2.Stable performance, low thermal resistance, effectively improve the heat transfer speed
3.Low hardness, its viscosity high, easy to use
4.By UL and V-O certification standards
Specification:
Product standard size 300mm*300mm, 200mm*400mm according to customer needs to cut the shapes
Basic thickness 0.3mm~5.0mm, special size and thickness can be customized
The product itself is slightly viscous, if need to strengthen the adhesive can be according to customer’s requirement
Product color is mass production, if need special color can be adjusted to the actual situation
