Interfacial Phase Change Silica Gel Thermal Conductive Material

Interfacial Phase Change Silica Gel Thermal Conductive Material

Model No.︰PC210

Brand Name︰Jiarifeng

Country of Origin︰China

Unit Price︰US $ 6.3 / pc

Minimum Order︰10 pc

Inquire Now

Product Description

Application :

High frequency microprocessor, chipset, graphics processing chips /power AMP chip, cache memory chip, customer homemade ASICS .

DC--DC converter, memory module, power module, memory module, solid state relay, bridge rectifier

Advantage :

Low thermal resistance under low pressure

Inherent viscosity, easy to use and not need to use the adhesive

No need preheating the radiator

Flow but not silicone oil

Low volatility -- less than 1%

Product Brief:

This material is heat reinforced polymer, to meet the thermal conductive of high terminal heat conduction application , reliability demand. Combined with the thermal resistance small channel so that the performance of the heat sink to achieve the best. Improve the micro processor, memory module DC - DC converter and the reliability of the power module.

The phase change characteristics : material is

solid at room temperature and is convenient to install, used between the heat sink and device. When they reach the product phase change temperature materials become soft, flowing, filled into the device small irregular contact surface. So completely have the ability to fill the gaps between the interface of the air gap and the device and heat sink, the phase change pad is better than that of non flow elastomer or graphite based thermal pad, and has the properties of thermal grease.

 

PROPERTIES  TABLE

Test Item

Unit

Thermal Conductive Phase Change Materials Test Results

Testing Method

PC210-A

PC210-B

PC210-P

PC210-Y

Color

--

Grey

Black

Pink

Yellow

visual

Carrier

--

None

Aluminum Foil  

None

None

--

Thermal Impedance

in2/w

0.035

0.03

0.05

0.05

ASTM D5470

Thermal Conductivity

w/m·k

2.5

2.5

1.0

1.0

ASTM D5470

Phase Change Temp

5060

5060

5060

5060

5060

Density

g/cm2

1.2

2.2

1.3

1.35

--

Thickness

mm

0.076/0.127

0.09

0.127

0.127

ASTM D374

Storage Temp

40

40

45

45

--

Temperature

-45125

-45125

-45125

-45125

--

Storage Time

Month

12

24

12

12

--

Payment Terms︰ cash

Product Image