Product Description

Thermal Silicone Encapsulants

The thermal conductive encapsulants add molding organic silicone sealant, use imported organic silicone as the main material, select the polymer materials as fillers, manufactured elaborately electronic potting glue, glue viscosity is divided into high, middle, low three type, color also can be optional according to customer's demand, and has heat conducting, flame retardant, bonding, sealing, waterproof, potting and encapsulation properties.

 

 

 

 

[Two component silicone sealant features]

◆Operational time: at room temperature, operation time within 240 minutes, especially for the use of

automatic production line, improve the work efficiency and save production cost;

◆Easy to operate: choose artificial sizing or mechanical sizing; without use additional primer coating.

◆Bonding material widely: can be applied to PC (Poly-carbonate), ABS, PP, PVC etc. other materials

and the surface of metal.

◆With excellent electrical properties: excellent insulating performance, thermal conductivity, heat

dissipation, anti-shock, corona resistance, anti-electric leakage and chemical mediator resistance

performance, so for electronics, electrical appliances and other products can provide protection,

sealing and insulation functions.

◆Temperature resistant performance: high and low temperature resistance , good ageing resistance.

After curing in the wide temperature range (60 ~ 200 ℃) to keep the rubber elasticity.

◆Flexible glue film: no shrinkage during curing, excellent toughness of the elastomer is formed after

curing, absorb vibration and shock, good impact resistance, good cushioning effect, for electronics,

electrical appliances, glass and other fragile products, to provide excellent resistance to shocks and

reliability.

◆Strong weather resistance : anti - ultraviolet radiation, aging resistance, anti - ozone, moisture proof,

waterproof, resist to salt atmosphere, mold etc., can work in the harsh natural environment .

 

PROPERTIES  PARAMETER  TABLE
Before Curing	Component (1:1)	Viscosity （cps）	Color	Component （10:1）	Viscosity （cps）	Color
	B  Group	3000	White fluid	A  Group	1000-2000	White/ Black
	A  Group	1520	Black/Grey/White	B  Group	1000-2500	Transparency
Test Item			Unit	Numerical Value		Test Method
Operating Performance	Mixture Ratio		KG	1：1	10:1	Metage
	After MixtureViscosity		cps	1980	2000	T1794
	Operable Time		Min（25℃）	≤60	≤80	TM650
	Curing Time		Min（25℃）	480	500	TM650
	Curing Time		min（80℃）	30	40	TM650
After Curing	Hardness		shore A	50--60	50--60	ASTM D2240
	Thermal Conductivity		W/m·K	0.8	1.5	ASTM D5470
	Dielectric Strength		kV/mm	≥27	15	ASTM D149
	Dielectric Constant		1.2MHz	3.0～3.3	3.0	GB/T12636
	Volume Resistivity		Ω·cm	≥1.0×1016	≥1.0×1014	ASTM D257
	Flame Rating		--	94-V0	94-V0	ULNo:E341634

Payment Terms︰ cash

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