BM180thermal insulation silicon adhesive plaster is used to high thermal insulation products. These products generally take low to tighten pressure element fixed way.

BM180highly suitable for smooth surface, has high thermal conductivity, this feature makes the interface thermal resistance under the low pressure reduced to a minimum. Low fastening pressure applications including using reed fixed dispersive semiconductor devices.

BM180has the characteristics of smooth surface that make the interfacial thermal reduce to a minimum, so as to obtain the maximum cooling performance.

Characteristic

1.Strong tension resistance,

2.wear resistance, good insulation performance,

3.Non adhesive, surface thin thickness, suitable for thermal insulation of power device，

4.This product has a superior wear resistance and tensile, recognized by many customers, may flush type into any shape.

Application: 
1. Military, aviation

2. Electronic switching equipment

3. Automobile electronic heating module

4. Motor control, communication equipment

5.Large power source , heating power device

6. Audio-visual products, TO integrated module

7. Power semiconductor, IS MOS tube IGBT chip

8. High voltage, high temperature, high power welding machine etc.

specifications: 
Sheet, die-cutting, roll, with adhesive and without adhesive

Basic size

0.18mm*300mm*50m 
Sheet can form different shapes according to the customer request processing, also can undertake gum processing to meet the customer demand.