Product Description

Application :

◆High frequency microprocessor, chipset, graphics processing chips /power AMP chip, cache memory chip, customer homemade ASICS .

◆DC--DC converter, memory module, power module, memory module, solid state relay, bridge rectifier

Advantage :

◆Low thermal resistance under low pressure

◆Inherent viscosity, easy to use and not need to use the adhesive

◆No need preheating the radiator

◆Flow but not silicone oil

◆Low volatility -- less than 1%

Product Brief:

This material is heat reinforced polymer, to meet the thermal conductive of high terminal heat conduction application , reliability demand. Combined with the thermal resistance small channel so that the performance of the heat sink to achieve the best. Improve the micro processor, memory module DC - DC converter and the reliability of the power module.

The phase change characteristics : material is

solid at room temperature and is convenient to install, used between the heat sink and device. When they reach the product phase change temperature materials become soft, flowing, filled into the device small irregular contact surface. So completely have the ability to fill the gaps between the interface of the air gap and the device and heat sink, the phase change pad is better than that of non flow elastomer or graphite based thermal pad, and has the properties of thermal grease.

 

PROPERTIES  TABLE
Test Item	Unit	Thermal Conductive Phase Change Materials Test Results				Testing Method
		PC210-A	PC210-B	PC210-P	PC210-Y
Color	--	Grey	Black	Pink	Yellow	visual
Carrier	--	None	Aluminum Foil	None	None	--
Thermal Impedance	℃in2/w	0.035	0.03	0.05	0.05	ASTM D5470
Thermal Conductivity	w/m·k	2.5	2.5	1.0	1.0	ASTM D5470
Phase Change Temp	℃	50～60	50～60	50～60	50～60	50～60
Density	g/cm2	1.2	2.2	1.3	1.35	--
Thickness	mm	0.076/0.127	0.09	0.127	0.127	ASTM D374
Storage Temp	℃	＜40	＜40	＜45	＜45	--
Temperature	℃	-45～125	-45～125	-45～125	-45～125	--
Storage Time	Month	12	24	12	12	--

Payment Terms︰ cash

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